ISPD 2021 Benchmark Contest - Wafer Scale Physics Modeling

A new frontier for partitioning, placement and routing

The ACM International Symposium on Physical Design (ISPD) in collaboration with Cerebras Systems is proud to organize the 2021 ISPD benchmark contest. The contest will run from January thru March 2021.

We welcome teams to participate in this contest. Register via this form

The 2021 edition of the ISPD benchmark competition features an innovative twist on traditional Physical Design. The task is to map a 3-D Finite Element model on a 2-D grid of processing elements in a supercomputer. The objectives are to maximize performance and accuracy, while minimizing interconnect length. This involves partitioning and placement algorithms.

Participating teams will be supplied benchmark examples and an open source program to evaluate the score of their program. The results will be judged on a set of ‘blind’ benchmarks. As in 2020 [1], substantial prizes will be given to the best teams.

A detailed description of the contest can be found in this file [2].

Important dates

Team Registration: This form Until January 27th, 2021
Initial benchmark designs, formats and evaluation tool made available: February 1st, 2021
Final submission of results: March 10th, 2021.

References

[1] Michael James, Patrick Groeneveld, Vladimir Kibardin, Ilya Sharapov, Marvin Tom, “ISPD Benchmark Contest 2021: Wafer Scale Physics Modeling”, http://www.ispd.cc/docs/cfp_ISPD2021Contest.pdf

[2] Michael James, Marvin Tom, Patrick Groeneveld, Vladimir Kibardin, “ISPD 2020 Physical Mapping of Neural Networks on a Wafer-Scale Deep Learning Accelerator”, Proc International Symposium on Physical Design 2020, pp 140-145,

[3] Kamil Rocki, Dirk Van Essendelft, Ilya Sharapov, Robert Schreiber, Michael Morrison, Vladimir Kibardin, Andrey Portnoy, Jean Francois Dietiker, Madhava Syamlal, Michael James, “Fast Stencil-Code Computation on a Wafer-Scale Processor”, Supercomputing 2020,  https://arxiv.org/pdf/2010.03660.pdf